Thermal Compound Thermal Cooling Paste Large Needle HY510 For CPU VGA LED Chipset
Features:
High stability and reliability
Apply to CPU, VGA, LED, Chipset ang PC components
Low thermai resistance, high condutivity for heat transfer
Compliance with RoHS REACH PFOS requirement
Specifications:
Net weight:35g
Package weight:45g
Color:Grey, White
Packing content:
1 x Thermal Compound
| Features |
|
| High stability and reliability |
| Apply to CPU, VGA, LED, Chipset ang PC components |
| Low thermai resistance, high condutivity for heat transfer |
| Compliance with RoHS REACH PFOS requirement |
| Specifications |
|
| Net weight |
35g |
| Package weight |
45g |
| Color |
Grey, White |
| Packing content |
|
| 1 x Thermal Compound |